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The Effects of AlN and Copper Back Side Deposition on the Performance of Etched Back GaN/Si HEMTs
Title | The Effects of AlN and Copper Back Side Deposition on the Performance of Etched Back GaN/Si HEMTs |
Publication Type | Journal Article |
Year of Publication | 2019 |
Authors | Pavlidis G, Kim SH, Abid I, Zegaoui M, Medjdoub F, Graham S |
Journal | IEEE Electron Device Letters |
Volume | 40 |
Issue | 7 |
Pagination | 1060 - 1063 |
Date Published | Jan-07-2019 |
ISSN | 0741-3106 |
DOI | 10.1109/LED.5510.1109/LED.2019.2915984 |
Short Title | IEEE Electron Device Lett. |